D. Tenciu, C.R. Iordanescu, R. Savastru, I.D. Feraru, A. Kiss, C.N. Zoita, R. Notonier, A. Tonetto, M. Eyraud, L. Tortet, 2012. Porous Al2O3 films obtained by PLD on copper templates. Digest Journal of Nanomaterials and Biostructures, 7(1), pp. 393 – 397, ISSN 1842-3582.

 Title: Porous Al2O3 films obtained by PLD on copper templates

Abstract: 

Porous Al2O3 films were deposited on copper thin film templates onto silicon substrates by means of pulsed laser deposition (PLD) technique using a KrF excimer laser. The copper films have been first deposited in vacuum on Si substrates at room temperature, with a particular distribution of Cu droplets to favour pores formation. Alumina deposition has been done following ablation of a pure Al target at 10-3 Torr oxygen pressure at different substrate temperatures: room temperature, 600 °C and 650 °C. The characterization of samples involved micro-Raman spectroscopy, FTIR spectroscopy, scanning electron microscopy (SEM), atomic force microscopy (AFM) and energy dispersive x-ray spectroscopy (EDS) to reveal structural and morphological properties. FTIR and Raman spectroscopy results corroborated with EDS analyses confirm the presence of alumina in the Al2O3/Cu/Si structures. SEM images show ~300 nm ordered pores in films deposited at room temperature.